高性能图形化SOI功率器件的研制

Fabrication of high performance patterned SOI power device

  • 摘要: 利用掩膜注氧隔离技术(Masked SIMOX)制备图形化SOI衬底,采用与常规1μm SOI CMOS工艺兼容的工艺流程,制备了图形化SOI LDMOS功率器件。器件的输出特性曲线中未呈现翘曲效应、开态击穿电压高于6V、关态击穿电压达到13V、泄漏电流的量级为10-8A;截止频率为8GHz;当漏工作电压3.6V,频率为1GHz时,小信号电压增益为6dB。直流和射频电学性能表明,图形化SOI LDMOS结构作为射频功率器件具有较好的开发前景。

     

    Abstract: Patterned SOI substrates were fabricated by masked SIMOX technology, and patterned SOI LDMOSFETs were fabricated by using a simple process compatible to conventional SOI CMOS technology. The devices shows good electrical performance, including flat output characteristic curves, an on-state breakdown voltage of 6V, an off-state breakdown voltage of 13V, a leakage current of 10-8A, a cut-off frequency of 8GHz, and a small signal voltage gain of 6dB at 1 GHz and the drain supply voltage of 3.6V. This patterned SOI LDMOS is a promising RF power device.

     

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