硅超薄可动悬空薄膜的弹性模量测试分析

Measurement and analysis on Young’s modulus of silicon super thin free-handing diaphragm

摘要: 利用纳米硬度计通过对超薄悬空薄膜的弯曲试验来测定硅可动悬空薄膜的弹性模量。硅悬空薄膜采用各向异性湿法腐蚀自停止技术制备。纳米硬度计测试方法精确测量了硅悬空薄膜的弯曲形变。试验研究表明,尺寸为ϕ2mm×1μm的硅悬空薄膜的弹性模量平均值为152GPa,差异为3.9%-6.8%。

Abstract: Young′s modulus were measured by free-handing diaphragm bending using a nano indentation.The measurements were made on boron-doped p⁺-silicon free-handing diaphragm which were fabricated by using anisotropic wet etching techniques. The proposed method measured silicon free-handing diaphragm bending degree.The measured mean Young′s modulus of silicon free-handing diaphragm with dimension of ϕ2mm×1μm is 152GPa,with 3.9%-6.8%difference.