光通信用厚膜SOI材料的制备与研究

Preparation and investigation of thick SOI films applied to photo-commu nication

  • 摘要: 利用SIMOX技术和硅外延工艺制备了厚膜SOI材料。采用Secco液腐蚀、椭圆偏振仪(SE)、扩展电阻(SRP)等技术对材料的性能进行了表征,分析了外延硅层中缺陷产生的主要原因。外延层电阻率纵向分布均匀,其缺陷主要来源于衬底缺陷延伸和表面的不平整。用制备的厚膜SOI材料制作了脊型光波导并完成了光损耗测试实验,得到了传输损耗为0.4dB/cm的波导结构。

     

    Abstract: The thick SOI films were prepared by SIMOX technology and Si epitaxy process.The thick SOI materials were characterized by Secco etching,SE and SRP.The dislocations and stacking faultsin epitaxial Si layer mainly result from the dislocationsin the SIMOX SOI substrate and the roughness of the substratesurface.The quality of SOI substrate affects epitaxial Si layer greatly.The resistivity of epitaxial layer is uniform.The rib waveguide was fabricated on the thick SOI material.Light can transmit in the waveguide successfully and the loss is 0.4dB/cm.

     

/

返回文章
返回