Abstract: Based on the demand of semiconductor integrated circuit industry, this paper comprehensively describes the control requirements, technical difficulties and development trend of high purity nickel-platinum target in the preparation process of purity, structure, permeability and surface quality. For the high purity nickel-platinum target used in the process below 65 nm, the purity gradually increased from 4 N5(99.995%) to 5 N(99.999%) and above. In terms of microstructure and permeability, the grain orientation should be precisely regulated to pursue high permeability while ensuring uniform microstructure. The surface quality is developing to low roughness.