激光消熔制备HBC太阳电池图形化发射极的研究
Study on Fabrication of Patterned Electrodes of HBC Solar Cells by Laser Ablation
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摘要: 本文提出了一种用激光消熔代替光刻掩模对准技术, 制备硅异质结背接触(HBC)太阳电池图形化电极的新方案, 以a-Si: H(i/p)基本结构单元为例从概念上证明了该方案制作图形化发射极的可行性。首先, 在沉积非晶硅薄膜a-Si: H(i/n+)后, 使用功率为7.8 W的激光消熔a-Si: H(n+)使a-Si: H(i)露出, 通过3D显微镜观察到相同消熔条件下的开槽宽度为51.9±1.4 μm; 然后, 沉积a-Si: H(p)和崭露的a-Si: H(i)接触且与n型衬底硅片形成异质pn结而获得了发射极a-Si: H(i/p)基本结构单元。在空气氛围中, 激光作用于非晶硅会使得消熔部分形成绝缘氧化层而影响载流子输运, 通过氢氟酸(HF)溶液浸泡去除绝缘氧化层, 浸泡15 s后氧化层厚度减小为未浸泡样品的1/3。钝化片激光消熔前后的有效少子寿命结果对比显示: 激光消熔钝化层薄膜后, 余下的薄膜对晶体硅的钝化性能大幅下降, 一方面, 由于钝化层厚度的减薄会影响少子寿命; 另一方面, 激光消熔过程会使非晶硅薄膜体内和薄膜与衬底界面处的氢含量大幅降低, 氢含量的减少必然导致硅网络中的悬挂键密度增大, 即深能级缺陷态增多加快光生载流子的复合。从TEM图像中也可观察到经激光消熔后, 钝化层结构有部分被晶化的现象, 部分晶化结构的出现说明氢含量会大幅降低。针对激光消熔后钝化层薄膜容易出现少氢的问题, 我们采用氢等离子体处理(HPT)来尝试向激光消熔后的钝化层注入原子氢, 对比HPT处理前后的少子寿命, 结合PL图像结果发现: 载流子复合显著降低且有效少子寿命由258 μs增大一倍至528 μs, PL发光强度明显由暗变亮, 证明HPT过程起到了向薄膜内注入原子氢的作用, 有效修复了激光消熔过程造成的钝化损伤。Abstract: In this work, a new scheme to fabricate patterned electrodes of silicon heterojunction backcontact (HBC) solar cells by using laser ablation instead of photolithographic mask alignment technology, which is proposed to simplify the process steps and reduce production costs. The basic structure unit of a-Si: H(i/p) is used as an example to prove the feasibility of the suggested scheme. Firstly, after initial deposition of amorphous silicon film a-Si: H(i/n+), a-Si: H(i) layer appears when a-Si: H(n+) was ablated by the laser with a power of 7.8 W, the width of the ablation groove observed under the 3D microscope is about 51.9±1.4 μm. Then a layer of a-Si: H(p) was deposited to contact with the exposed a-Si: H(i) so that forming a hetero-pn junction with the n-type substrate silicon wafer, thus obtaining the emitter a-Si: H(i/p) basic structural unit. In the air atmosphere, the effect of laser on amorphous silicon will generally cause the formation of an insulating oxide layer in the ablation area and affect the transport of photo-carriers. The insulating oxide layer can be removed by soaking in hydrofluoric acid (HF) solution, after soaking for 15 s, the thickness of the oxide layer is reduced to 1/3 of that of the unsoaked sample. Comparing the PL images and effective minority lifetimes before and after laser ablation, we have found there are two possible reasons to influence the passivation performance during laser ablation. On the one hand, the remaining film thickness became thinner due to a part of film was ablated, which determines the passivation ability descending. On the other hand, the hydrogen content in the film on the a-Si(i)/c-Si interface marginally losses owing to the thermal-effects of laser ablation process, which must lead to the silicon dangling bonds are booming that is to say the increasing deep-level defect density promote the recombination of photo-carriers. Additionally, we also have found a crystalline microstructure in the part of remaining passivation film, which is a powerful proof of H-desorption after laser ablation. Therefore, it presents both the decreasing lifetime and the deteriorated PL images after laser ablation. In view of the decreasing phenomenon of H content, we employ hydrogen plasma treatment (HPT) to recover the passivation samples after laser ablation, the PL images show that the carrier recombination is significantly reduced and the effective minority carrier lifetime is doubled from 258 μs to 528 μs, effectively repairing the passivation damage caused by the laser ablation process.
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