Abstract: In recent years, with manufacturing technology advancing into the atomic age, significant progress has been achieved in nano-manufacturing technologies. However, as the dimensions of manufacturing continue to decrease, the conventional “deposition-lithography-etching” nanofabrication process faces unprecedented challenges in terms of precision, efficiency, and cost. There is an urgent need to develop new technological routes. The area selective atomic layer deposition technology can achieve selective deposition by utilizing the nucleation differences of materials in different areas. Given its advantages of high efficiency, precise control and selective deposition in targeted regions, this technology has emerged as a highly promising alternative to the traditional “deposition-lithography-etching” process. Based on the principles of area selective atomic layer deposition, this paper reviews the current status of its development systematically, outlines its primary applications, and provides an outlook on the future advancements of this technology.