高质量NbTiN超导薄膜制备工艺改进与性能表征

Improvement of fabrication process and property characterization of high-quality NbTiN thin films

  • 摘要: NbTiN薄膜因具有低电阻率、高临界温度、高临界电流密度以及高临界磁场等优异的超导电子学性能,被广泛应用于各类超导电子器件和量子混合电路中。然而,传统共溅射过程中的靶中毒现象阻碍了高质量NbTiN薄膜的稳定制备,且薄膜沉积速率受限。为解决这一问题,并提升沉积速率与均匀性,对溅射气体与反应气体的导入方式进行了改进:将氩气(Ar)单独导入靶材附近,而氮气(N2)则直接通入衬底材料附近。改进后的NbTiN沉积工艺显著提高了低气压下等离子体的稳定性,并能够在不同衬底上制备出具有优良超导电性的NbTiN薄膜。

     

    Abstract: NbTiN thin films have gained widespread application in superconducting electronics and quantum hybrid circuits owing to their superior superconducting characteristics, such as low resistivity, high critical temperature , high critical current density, and high critical magnetic field. Nevertheless, the target poisoning effect in conventional co-sputtering methods poses significant challenges to the stable fabrication of high-quality NbTiN films, while also restricting the deposition rate. To mitigate this problem and enhance both the deposition rate and film quality, this study introduced a modification in the delivery of sputtering and reactive gases. Specifically, argon gas was directed toward the niobium and titanium targets, while nitrogen gas was exclusively supplied to the substrates. By employing this modified NbTiN deposition technique, plasma stability was improved at relatively low pressures, enabling the preparation of high-quality NbTiN films on various substrates.

     

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