Abstract: Composite materials are extensively utilized in wearable electronic devices due to their superior mechanical properties. The curing process is crucial in determining the performance of these materials. Addressing the limitations of current curing process monitoring methods, which often compromise material performance, this paper introduces a flexible dielectric sensor capable of embedded nondestructive monitoring. The sensor's parameters are optimized through COMSOL simulation. The simulation findings indicate that the optimized sensor employs a reduced electrode length (30 mm) and fewer electrodes (10), while maintaining the same electrode width and spacing in its parameter configuration. This design achieves a high sensitivity of 0.0143 pF/mm² while ensuring that the parasitic capacitance remains controlled at 21.3 pF. The optimized flexible dielectric sensor demonstrates excellent flexibility for conforming to complex three-dimensional surfaces and enhances the stability of sensor monitoring performance. This advancement provides an efficient and reliable solution for applying composites in wearable electronic devices.